Quote Originally Posted by Abuilder View Post
So much for the plumbing solder idea. LOL
High speed circuit printing yes.

Formulated for both standard and fine pitch stencil printi
ng, at print speeds of between 25mm/sec (1”/sec) and
200mm/sec (8”/sec), with stencil thickness’ of 0.004”
(0.10mm) to 0.006” (0.15mm). Blade pressures should be
0.16-0.34 kg/cm of blade (0.9 -2Ibs/inch), depending upo
n the print speed. The higher the print speed employed
the higher the blade pressure that is required



Kester 70-3213-0810 NXG1 No-Clean Solder Paste for Lead-Free Applications, 500 gram Jar
The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys
Longest shelf life at 8 months
Looks to be a flux used with a metal brush and not solder at all. And according to the info after 8 months the efficiency starts going downhill.