So much for the plumbing solder idea. LOL
High speed circuit printing yes.
Formulated for both standard and fine pitch stencil printi
ng, at print speeds of between 25mm/sec (1”/sec) and
200mm/sec (8”/sec), with stencil thickness’ of 0.004”
(0.10mm) to 0.006” (0.15mm). Blade pressures should be
0.16-0.34 kg/cm of blade (0.9 -2Ibs/inch), depending upo
n the print speed. The higher the print speed employed
the higher the blade pressure that is required
Kester 70-3213-0810 NXG1 No-Clean Solder Paste for Lead-Free Applications, 500 gram Jar
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