Maximising my $crap

Originally Posted by Mechanic688

Keep the heatsinks from the cpu's separate as their extruded and when you point it out the yard they should pay you for extruded, for us it's .10 - .15 higher.

I'm glad you brought this up, I pointed this out to my yard and they told me that that was incorrect. Should I have asked for the gun test?

Originally Posted by Mechanic688

Sure look extruded to me, my yard pays for extruded as long as I have it in a separate bucket

Good call, time for a new yard for heat sinks!

I found this information about heat sink materials pretty interesting


The most common heat sink materials are aluminium alloys.[5] Aluminium alloy 1050A has one of the higher thermal conductivity values at 229 W/m•K [6] but is mechanically soft. Aluminium alloys 6061 and 6063 are commonly used, with thermal conductivity values of 166 and 201 W/m•K, respectively. The values depend on the temper of the alloy.

Copper has around twice the conductivity of aluminium, but is three times as dense [5] and, depending on the market, around four to six times more expensive than aluminium. [5] Aluminium can be extruded, but copper can not. Copper heat sinks are machined and skived. Another method of manufacture is to solder the fins into the heat sink base.

Diamond is another heat sink material, and its thermal conductivity of 2000 W/m•K exceeds copper five-fold. [7][unreliable source?] In contrast to metals, where heat is conducted by delocalized electrons, lattice vibrations are responsible for diamond's very high thermal conductivity. For thermal management applications, the outstanding thermal conductivity and diffusivity of diamond is an essential. Nowadays synthetic diamond is used as submounts for high-power integrated circuits and laser diodes.

Composite materials can be used. Examples are a copper-tungsten pseudoalloy, AlSiC (silicon carbide in aluminium matrix), Dymalloy (diamond in copper-silver alloy matrix), and E-Material (beryllium oxide in beryllium matrix). Such materials are often used as substrates for chips, as their thermal expansion coefficient can be matched to ceramics and semiconductors.